IC型（自动插件）EAD
Pitch:2.54mm
上拨式拨码开关 贴片式
Features
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Same size with IC, can be assembled by any automatic IC inserter.
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Molded 0.3" integrated circuit packing outline allowing automatic insertion.
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Smaller size makes better heat convection during PC board reflow wave soldering.
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Top tape sealed to withstand wave soldering, board washing.
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All plastics are UL 94V-0 grade fire retardant.
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Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering.
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RoHS Compliant
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